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Simulation / ModellingTrack 2

Teledyne e2v technology developments: small pixel, HiRho pixel and TDI developments

Mr. Georgios Tsiolis

Teledyne e2v

Day

Monday · 2026-10-12

Time

2:00 PM - 3:20 PM

Track

Track 2

Session

Detector Manufacturers: recent highlights and roadmaps

Venue

ICSO 2026 Conference Venue

Hall Track 2Session Detector Manufacturers: recent highlights and roadmaps

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In 30 seconds

Teledyne e2v is advancing silicon sensor technology through 3.5µm small-pixel development, HiRho fully-depleted substrates, and new Time Delay Integration (TDI) architectures. HiRho technology enhances Near-Infrared performance by improving quantum efficiency while maintaining Modulation Transfer Function (MTF) through backbias voltage. These developments ensure high-performance imaging for demanding missions such as Arrakihs, even at cryogenic operating temperatures.

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Topics & Subtopics

Detectors & PhotonicsOptical Hardware & ManufacturingInstrument PerformanceVisible DetectorsOptical Materials

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ID: icso26_020

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