Teledyne e2v technology developments: small pixel, HiRho pixel and TDI developments
Mr. Georgios Tsiolis
Teledyne e2v
Day
Monday · 2026-10-12
Time
2:00 PM - 3:20 PM
Track
Track 2
Session
Detector Manufacturers: recent highlights and roadmaps
Venue
ICSO 2026 Conference Venue
Track indicates the session hall. Refer to the on-site programme board for the exact room number and any last-minute room changes.
In 30 seconds
Teledyne e2v is advancing silicon sensor technology through 3.5µm small-pixel development, HiRho fully-depleted substrates, and new Time Delay Integration (TDI) architectures. HiRho technology enhances Near-Infrared performance by improving quantum efficiency while maintaining Modulation Transfer Function (MTF) through backbias voltage. These developments ensure high-performance imaging for demanding missions such as Arrakihs, even at cryogenic operating temperatures.
Read the full paper
Access the complete technical paper via the official ICSO 2026 programme.
Topics & Subtopics
Source traceability
ID: icso26_020
Schedule facts reproduced from the published ICSO 2026 programme. Enrichment metadata is a discovery aid, not a scientific classification.